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Helios NanoLab™ DualBeam™

Imaging, analysis and control of matter at the nanoscale — keys to future research and development — are routine with the Helios NanoLab™ 50 series DualBeam™ . This SEM/FIB combines the most advanced scanning electron microscope (SEM) and focused ion beam (FIB) technologies with innovative gas chemistries, detectors and manipulators. Featuring unsurpassed SEM resolution, image quality and stunning Tomahawk™ FIB performance, imaging, milling or preparing samples is fast and easy for semiconductor and data storage labs, research facilities and industrial applications.

Introducing the Helios NanoLab 50 Series

Outstanding imaging is standard with the Helios NanoLab 50 series's Extreme High Resolution (XHR) electron beam column, which incorporates the novel monochromator design found on the MagellanTM XHR SEM, along with a complete suite of detectors and software enhancements. It achieves superb contrast and resolution (sub-nanometer resolution from 30kV all the way down to 1kV) without compromising the ability to perform analytical work at higher currents. With the FIB, high-current and low-energy performance are superior and do not compromise the ultimate resolution of 4.5nm at 30kV (as measured by FEI’s many-edge rise distance method).

The customized detectors integrated on the Helios NanoLab 50 series enable researchers to access precise topographic, chemical or crystallographic information from the sample. Combining automated FIB milling, SEM analysis and high-accuracy sample manipulation, the Helios NanoLab 50 Series DualBeam is the preferred solution for acquiring high-resolution 3D data.

Relying on its advanced 16-bit digital pattern generator, the Helios NanoLab 50 series allows very fine and complex patterns to be written directly with the FIB. Direct deposition and enhanced etching rely on the now well established FEI gas injection system (GIS) and over 10 beam chemistry processes, that meets advanced needs as varied as circuit editing or nanoprototyping.

The Helios NanoLab 50 series is also unique because its automated sample preparation capabilities, using FEI's AutoTEM™ G2 software, yields thin samples that are prepared rapidly and with very high reliability. The Tomahawk FIB pioneers high-quality sample preparation using advanced endpointing and very low kV FIB cleaning—ideal for making localized samples (thinner than 50nm with damage thickness below 2nm) for observation in high-resolution S/TEMs.

Helios NanoLab 1200
The Helios family also includes the Helios NanoLab 1200 , a full 300 mm wafer platform providing unmatched performance for larger samples where the need to maintain wafers intact is critical.

FEI’s industry leadership in full wafer DualBeam technology now benefits from advanced electron and ion optics to bring unprecedented resolution to full wafer TEM (transmission electron microscope) sample preparation, defect characterization, and failure analysis.

  • Defect Analysis
  • Failure Analysis
  • in situ NanoProcesses
  • Materials Qualification