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Jiaco Instruments
JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated
atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2
-only
recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for
advanced package types like 3D, SiP, WLCSP, high Tg, Chip on Board, BOAC; all
without process induced damage for reliable failure analysis and quality control.
SEE: Jaico
Description
The MIP decapsulation allows one to easily access the area of interest during failure analysis protocol and facilitates determination of the cause of the failure. Its benefits include rapid sample preparation without introduction of artifacts which may contribute uncertainty to the fault detection process. This, in turn, facilitates the engineer to reach a conclusion as to the true root cause of the problem, and to define a permanent fix to remove the issue for the future. This is invaluable also during qualification procedures for new processes and materials.
Comparison between MIP and Acid:
Comparison between MIP and Conventional Plasma:
Application Range:
I. Wire Bond:
Ag Wire
Cu, PCC, Au, Al Wire
Fresh & Thermally Stressed
II. Flipchip:
RDL
Cu Pillar, Solder Bump
Fan-in and Fan-out WLP
III. Chip:
BOAC
GaAs, GaN
SAW, BAW
IV. Package:
2.5/3D
SiP, CoWoS
PCB
V. Encapsulant:
High Tg
Underfill, DAF, FOW
Glob Top
Clear Mold, Die Coat
VI. Failure Type:
EOS
Migration
Contamination
Corrosion
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